Memory Strategic Forum
| Date: | Monday, June 29, 2020 |
| Time: | 08:45-11:25 |
| Venue: | Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai |
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For Memory business, 2019 is a year of significant. According to IC Insight, capital investment will reduce 8% from $105.9 billion in 2018 to $97.8 billion in 2019. In the contrary, technology evolution is speeding up. Mainstream DRAM density goes up to 16Gb per chip on 1Znm process, SK Hynix announced 128 layers 4D NAND paired with its Periphery Under Cell (PUC) technology.China Memory industry is forging quickly. YMTC launched production of 64 layers 3D NAND on Xtacking technology, Unigroup announced it's DRAM strategy, Innotron started the production of 8Gb DDR4.
In the era of Big Data, AI and IOT, explosive needs of low-power computing demands Memory innovations. 3D packaging, MRAM, PCRAM and RERAM move toward maturity, in-Memory computing is an emerging concept.
Let us meet again in SEMICON CHINA 2020!
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Agenda / 议程
| 08:45-09:15 | Registration 来宾登记 |
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Moderator / 主持人 Gavin Wang 王兆华 投资副总裁 湖杉资本 |
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09:20-09:45
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AI Memory for Data Intensive Applications 針對數據密集型應用之 AI Memory Dr. Alex Wang 王其国 President 总经理 Powerchip Technology Corporation 力晶科技股份有限公司 |
09:45-10:10
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Keynote: Memory technology and brand 存储技术和品牌 Huabo Cai 蔡华波 Board Chairman 董事长 Longsys Electronics 江波龙电子 |
| 10:10-10:35 |
Memory Device Trend and Test Technology Challenges Jintie Li 李金铁 Vice President 中国区副总经理 Advantest 爱德万测试 |
10:35-11:00
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科创版助推差异化半导体设备技术创新 Dr. David Wang 王晖 Board Chairman 董事长 ACM Research 盛美半导体设备（上海）股份有限公司 |
11:00-11:25
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Memory packaging technology 存储封装技术 Jianmin Li 李健民 Packaging R&D Director封装技术开发总监 Amkor Assembly & Test (Shanghai) Co., Ltd. 安靠封装测试（上海）有限公司 |
* 议程变化恕不另行通知