Keynote Speakers

Keynote Speakers

Inside Program: Conference Program l Keynote Speakers l Tutorials
Workshops l Year in Review l Highlight Papers | Invited Speakers

IRPS 2024 Keynote Speakers:

Hafnium-Oxide-Based Ferroelectric Devices for Low-Power Memory and AI Applications: Promises and Reliability Challenges

Shinichi Takagi (Professor, The University of Tokyo, Japan)

Abstract: Si-friendly HfO2-based ferroelectric devices including FeRAMs and FeFETs are promising for future integrated memory and AI applications with high energy efficiency. On the other hand, a variety of reliability issues can pose serious limitations on the practical applications. This presentation will discuss the promise and reliability of HfO2-based FeRAMs and FeFETs with an emphasis on ferroelectric film thickness scaling, and will also touch on a new AI computation using these devices, reservoir computing.

Shinichi Takagi received B.S., M.S., and Ph.D. degrees in electronic engineering from the University of Tokyo, Japan, in 1982, 1984, and 1987, respectively. He joined the Toshiba Research and Development Center, Japan, in 1987, where he was engaged in research on the device physics of Si MOSFETs. From 1993 to 1995, he was a Visiting Scholar at Stanford University, where he studied Si/SiGe hetero-structure devices. In October 2003, he moved to the University of Tokyo, where he is currently working as a professor in the Department of Electrical Engineering and Information Systems. He has authored and co-authored more than 1100 papers in technical journals and international conferences. Also, he received 18 awards including IEEE Paul Rappaport Award (2014), IEEE Andrew S. Grove Award (2013), IEEE George E. Smith Award (2003), and Purple Ribbon Medal from the Japanese government (2017). His recent interests include the science and technologies of advanced CMOS devices using Ge and III-Vs, ferroelectric devices, and cryo-CMOS. Dr. Takagi served on the technical program committee of several international conferences including IEDM, Symposium on VLSI Technology, IRPS, SSDM, and ISSCC. He is a member of the IEEE Electron Device Society, the Institute of Electronics, Information, and Communication Engineers (IEICE), and the Japan Society of Applied Physics (JSAP).

Innovative Technologies for Sustainable Future of Semiconductor Industry

Su Jin Ahn (EVP, Advanced Technology Development Office at Samsung Semiconductor R&D Center, Samsung)

Abstract: In the last decade, we have witnessed an unprecedented revolution of artificial intelligence (AI) as well as various smart devices such as smart phones, AV/VR devices, smart vehicles and robots. Semiconductor is a key player in this revolution as they are at the heart of many inventions related to the computing devices. These transformative trends of AI and smart devices will continue to open up explosive growth opportunities for the semiconductor community. However, there are compelling technical challenges to fully grasp its growth potential. It has become even more challenging to meet the requirements such as Power, Performance and Area (PPA) together with reliability, while continuously scaling the physical dimensions of semiconductor devices below 10 nm. To address these challenges, technical innovations in terms of device structures, materials, processes and equipment are essential. After reviewing the evolution of the semiconductor technologies over the past 50 years, this paper will identify today’s technical challenges and discuss promising innovative technologies for sustainable future. These technologies encompass not only logic and memory technologies such as DRAM, Flash and emerging memory technologies but also advanced packaging technologies.

Su Jin Ahn is a corporate EVP and the head of Advanced Technology Development Office at Samsung Semiconductor R&D Center. She is currently in charge of research and development of Samsung’s future innovative memory, logic devices and packaging. She joined Samsung Electronics in 1999 and engaged in the research and development of cutting edge technology in DRAM, Flash, MRAM, PRAM and etc until 2013. She has led the development of new technology of 3D V-NAND products in Samsung Semiconductor R&D Center and Memory Business Division from 2014 to 2023. She received the B.S., M.S., and Ph.D. degrees in Electrical and Electronics Engineering from Pohang Science and Technology in Korea in 1993, 1996, 1999 respectively. She has published 50 papers at international conferences and SCIE, and holds 40 domestic and international patents. She served as an executive committee member in IEDM Society from 2014 to 2018, and is working as an IEEE Journal review since 2007.

Utility-scale Quantum Computing - Advances and Future Challenges

Rajeev Malik (Program Director, Systems Development & Deployment at IBM Quantum, USA)

Abstract: Quantum Computing has continued to gain traction in having the potential to shape the future of computing. In this talk, I will discuss some of the latest developments in the field - from a technical as well as business viewpoint. This presentation will also share engineering advancements and challenges, not only in the processors powering the quantum computer but the entire system. As we move on the path towards quantum advantage and broader commercialization of this technology, the focus on longer term reliability of the key components will become even more critical and aspects related to superconducting qubit-based quantum computers will be highlighted. Finally, a vision of where we see the inevitable convergence of high performance classical computers (HPC) with quantum computers, in what is termed as quantum-centric supercomputing will be presented.

Rajeev Malik is Program Director, Systems Development & Deployment at IBM Quantum in Yorktown Heights, NY. He leads a team responsible for developing and characterizing IBM’s next generation quantum systems as well as deployment of these systems worldwide. He leads IBM’s execution of the systems roadmap that enables a global base of enterprise clients, developers, researchers, and educators using state-of-the-art quantum computing infrastructure to develop applications and use cases towards quantum advantage. His team currently manages the entire fleet of 20+ quantum systems worldwide including in datacenters and client sites in US, Germany and Japan.

He has previously led teams providing cloud infrastructure for the quantum service offering, technology development and foundry interface for multiple generations of IBM’s high end semiconductor microprocessors integral to their mainframe and Power offerings, including eDRAM. He has a PhD from the University of Michigan, Ann Arbor and his B.Tech from IIT, Bombay

Analog Technology Scaling and Reliability Implications

Sameer Pendharkar (Vice President of Advanced Technology Development, Texas Instruments, USA)

Abstract: A typical automotive or industrial end equipment system consists a multitude of analog, power and mixed signal ICs. These ICs are fundamentally driven by similar underlying vectors such as increasing performance and capability while reducing size and cost and maintaining or enhancing reliability. The talk will focus on key analog and power component careabouts and reliability mechanisms that are critical for scaling these components and also discuss advances in technology and component design that enable scaling while achieving the required technology reliability.

Sameer completed his undergraduate studies and graduate studies in Electrical Engineering from the Indian Institute of Technology, Bombay and the University of Wisconsin-Madison respectively.　He joined TI in 1996 and is currently a TI Senior Fellow and Vice President of Advanced Technology Development. Sameer and his team are responsible for setting and executing the overall technology development strategy for TI. He also serves as the Chairperson on the Board of Directors of the Semiconductor Research Corporation (SRC). He has published more than 100 technical papers in leading academic journals and conferences and has been granted more than 185 U.S. patents.